Learning objectives
1. Knowledge and understanding
The course provides an overview of the design and implementation of an electronic system with discrete components. In this context we analyze the issues related to signal propagation and interference that can arise between them, the choice of materials to be used according to the working frequency of the system. Is carried out the analysis of existing techniques to build a circuit board.
2. Applying knowledge and understanding
The course also provides, through guided exercises, the use of CAD for design, simulation and manufacturing of printed circuit boards.
Prerequisites
Physics,
Electrical Engineering,
Electronic Engineering
Course unit content
- Fundamentals
- Shortcomings of Point-to-Point Wiring
- Transmission Lines
- Terminations
- Ground Planes and Layer Stacking
- Power Supply Systems
- Signal Integrity
- Board Partitioning
- Designing for Electromagnetic Compatibility
- Computer-Aided Design
- Laboratory
Full programme
- Fundamentals
Frequency and Time.
Time and Distance.
Lumped versus Distributed Systems: Length of Rising Edge.
Four Kinds of Reactance: Ordinary Capacitance, Ordinary Inductance, Mutual Capacitance, and Mutual Inductance.
- Shortcomings of Point-to-Point Wiring
Distortion.
Electromagnetic Interference.
Crosstalk.
- Transmission Lines
Infinite Uniform Transmission Line.
Effect of Source and Load Impedance.
Special Transmission Line Cases.
Line Impedance and Propagation Delay.
- Terminations
“L” length Transmission Line.
End Terminators.
Source Terminators.
AC Biasing for End Terminators.
Resistor Selection.
- Ground Planes and Layer Stacking
High-Speed Current Path.
Crosstalk in Solid and in Slotted Planes.
Crosstalk in Cross-Hatched Ground Planes.
Crosstalk with Power and Ground Fingers.
Rent Rule.
20H and 3W Rules.
How to Stack Printed Circuit Board Layers.
- Power Supply Systems
Providing a Stable Voltage Reference.
Distributing Uniform Voltage.
Everyday Distribution Problems.
Choosing a Bypass Capacitor.
- Signal Integrity
Ringing and Reflection.
Crosstalk.
Power and Ground Bounce.
Shunt and Guard Traces.
Clock Lines.
Routing Strategies.
- Board Partitioning
Segmentation rules and their Connection.
Data Line Filters.
Connectors.
Backplanes.
- Designing for Electromagnetic Compatibility
EMC and EMI Regulation.
Cabling, Grounding and Shielding.
Printed Circuit Board Technology
State of the Art.
- Computer-Aided Design
Introduction to the Cadence CAD program.
The Design Process Flow: From Schematic to PCB.
- Laboratory
Exercises with the program CAD Cadence.
Realization and Testing of a Hardware Project in Through-Hole or SMT Technology.
Bibliography
[1] “High-Speed Digital Design: A Handbook of Black Magic”, Haward W. Johnson, Martin Graham. Prentice Hall, 1993.
ISBN 0-13-395724-1
[2] “High-Speed Signal Propagation: Advanced Black Magic”, Haward W. Johnson, Martin Graham. Prentice Hall, 2003.
ISBN 0-13-084408-X
[3] “Grounding and Shielding Techniques in Instrumentation”, Ralph Morrison,
3rd Edition. John Wiley & Sons, 1986.
ISBN 0-471-83805-5
[4] “Coombs’ Printed Circuit Handbook”, Clyde F. JR. Coombs,
McGraw Hill, 2001.
ISBN 0071350160
[5] “Noise Reduction Techniques in Electronic Systems”, Henry W.Ott,
Second Edition John Wiley & Sons, 1988 .
ISBN 0-471-85068-3
[6] “Complete PCB Design Using OrCAD ® Capture and PCB Editor” Kraig Mitzner, John Newnes, May 2009 .
ISBN-13: 9780750689717
[7] “Electromagnetic Compatibility Engineering”, Henry W.Ott, Second Edition John Wiley & Sons, 2009.
ISBN 978-0-470-18930-6
Teaching methods
traditional classroom lessons. (40% of the duration of the course)
Laboratory exercises with CAD program. (60% of the duration of the course)
Assessment methods and criteria
Written test.
Laboratory Project with written report.
Other information
The written exam will be held at the end of the course (closed-answer questions). The project is carried out in groups of two / three students. The final report of the project is one for each group of students.
At the final assessment the written exam accounts for 60% / 65%, while the final report for the project with the remaining 40% / 35%.
