Learning objectives
This course is conceptually organized in two parts.
At first, it provides the students with skills and knowledge required to understand the technological processes and design issues of electronic and optoelectronic devices for different applications, with the main goal of stressing the state of the art, the limits and the impact of technology on the final performance of electronic device.
In this respect, training also extends to knowledge and practical use of advanced CAD tools to design both Silicon and non Silicon based semiconductor devices, as far as optoelectronic components.
A second goal is to analyze the way advanced technologies and techniques can be used (i) to capture energy from the environment and to transform it into electrical energy (Energy Harvesting), and (ii) to generate, transmit and store energy in the Smart-grids.
Prerequisites
- - -
Course unit content
Silicon planar process: the different steps of silicon planar process are analyzed showing the main technological constraints and the improvement capabilities; some important processes are studied in detail (i.e. CMOS process).
The scaling, integration and time to market concepts in semiconductor industry are presented starting from ITRS (International Technology Roadmap for Semiconductors), with special attention to MOSFET devices, semiconductor memories, and interconnection lines which are analyzed from the point of view of materials, technologies, process techniques and new structures.
Photovoltaic modules: some of the main photovoltaic technologies are analyzed, and special emphasis is given to thin film solar cells.
Smart-grid: working definitions and fundamental components of the ditributed generation and storage of energy in the "smart" electrical grid.
Some of the main techniques, technologies and applications of energy harvesting are presented.
Advanced CAD tools to analyze and design some of the described devices are used (i.e. modelling of solar cells).
Full programme
I) Silicon planar process:
Silicon wafer production;
Thermal Oxidation;
Lithography;
Doping techniques: diffusion and ion implantation;
Epitaxial Deposition;
Deposition technique of dielectric and conductor materials ;
Etching;
Packaging.
II) Scaling, integration and time to market:
Ideal and real scaling: definition, limits and comparison;
Short channel effect: technological and architectural solutions.
Technological processes: NMOSFET, CMOS, BJT, SOI MOSFETs.
III) Solar cells:
Crystalline and amorphous silicon-based solar cells and modules;
Thin film solar cells: CIGS and CdTe based solar cells.
III-V multi-junctions solar cells
IV) Energy harvesting: from vibration, solar energy, piezoelectricity.
V) Smart-grids: working definitions, fundamental components, renewable energy sources integration, energy storage.
VI) Analysis and design of electronic devices with the Synopsys-Sentaurus tcad tool.
Bibliography
1) S.M.Sze, "ULSI technology", Mcgraw hill, 1996
2) S.M.Sze, "VLSI technology", McGraw-Hill Book Co., 1983
3) G. Soncini, "Tecnologie microelettroniche", Boringhieri, 1986.
4) Vijay K. Varadan, "Smart material systems and MEMS : design and development methodologies" Wiley, 2006.
Teaching methods
Oral Lessons and Laboratory Activities
Assessment methods and criteria
Oral examination.
Other information
Slides on the topic of the course and prepared by the teacher are available for the students. The download of the slides from lea.unipr.it is allowed for registered students.
